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MCP130T-460I/TT - Microchip

Description: Microchip MCP130T-460I/TT, Voltage Supervisor 4.35 → 4.6 V, 3-Pin SOT-23

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Symbol
MCP130T-460I/TT - Microchip - PCB symbol
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PCB Footprints
MCP130T-460I/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - (TT)(SOT-23)(2001version)
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3D Models
MCP130T-460I/TT - Microchip - 3D model - SOT23 (3-Pin) - (TT)(SOT-23)(2001version)
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MCP130T-460I/TT Details

  • Manufacturer Part Number:

    MCP130T-460I/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    MNL RST:N;PW FL IO:N;PRG RST DLY:N;WD:N;WDO:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.48V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.3 mm

MCP130T-460I/TT Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP130T-460I/TT should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure reliable operation across the full temperature range, it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and secured to the PCB.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It is crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • Yes, the MCP130T-460I/TT is designed to operate in high-vibration environments. However, it is essential to ensure that the device is properly secured to the PCB and that the PCB is designed to withstand the vibration levels expected in the application.
  • To troubleshoot thermal performance issues, start by verifying that the device is properly soldered and secured to the PCB. Check for any signs of thermal interface material degradation or delamination. Ensure that the PCB layout and design meet the recommended guidelines, and verify that the device is operating within the recommended temperature range.

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MCP130T-460I/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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