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MCP14700T-E/SN - Microchip

Description: Gate Drivers 4A Hi-Side MOSFET Driver

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MCP14700T-E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 23A640-I/SN
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MCP14700T-E/SN - Microchip  - 3D model - Small Outline Packages - 23A640-I/SN
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MCP14700T-E/SN Details

  • Manufacturer Part Number:

    MCP14700T-E/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    2 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.046 µs

  • Turn-on Time:

    0.035 µs

  • Width:

    3.9 mm

MCP14700T-E/SN Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the MCP14700T-E/SN evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The input capacitor selection depends on the input voltage, output voltage, and output current requirements. A general guideline is to choose a capacitor with a capacitance value between 1-10 μF, a voltage rating of at least 1.5 times the input voltage, and a low equivalent series resistance (ESR) to minimize voltage ripple and ensure stability.
  • The maximum ambient temperature for the MCP14700T-E/SN is 125°C. As the ambient temperature increases, the device's performance may degrade, including reduced output voltage accuracy, increased output voltage ripple, and decreased efficiency. It's essential to ensure proper thermal management and heat sinking to maintain optimal performance.
  • Yes, the MCP14700T-E/SN is suitable for high-reliability and automotive applications. It meets the requirements of the AEC-Q100 automotive standard and is designed to operate in harsh environments. However, it's essential to follow proper design and testing guidelines to ensure the device meets the specific application requirements.
  • To troubleshoot issues with the MCP14700T-E/SN, start by verifying the input voltage, output voltage, and output current. Check for proper component selection, PCB layout, and thermal management. Use oscilloscopes and thermal imaging cameras to identify any anomalies. Consult the datasheet, application notes, and Microchip's technical support resources for guidance on troubleshooting and debugging.

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MCP14700T-E/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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