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MCP1525T-I/TT - Microchip

Description: 2.5V Precision Voltage Reference

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PCB Footprints
MCP1525T-I/TT - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - (TT)(SOT-23)(2001version)
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3D Models
MCP1525T-I/TT - Microchip  - 3D model - SOT23 (3-Pin) - (TT)(SOT-23)(2001version)
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MCP1525T-I/TT Details

  • Manufacturer Part Number:

    MCP1525T-I/TT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, TO-236, SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23-3

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.525 V

  • Output Voltage-Min:

    2.475 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.12 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temp Coef of Voltage-Max:

    50 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.96 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    1%

  • Width:

    1.3 mm

MCP1525T-I/TT Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP1525T-I/TT involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces to reduce noise and EMI. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the stability of the output voltage, it is essential to choose the correct output capacitor value and type. A minimum capacitance of 10uF with an ESR of 1 ohm or less is recommended. Additionally, the output capacitor should be placed close to the device to minimize the loop area and reduce noise.
  • The maximum input voltage that the MCP1525T-I/TT can handle is 15V. Exceeding this voltage may damage the device. It is recommended to add input voltage protection, such as a voltage regulator or a TVS diode, to prevent damage from voltage spikes or surges.
  • The output voltage of the MCP1525T-I/TT can be calculated using the following formula: Vout = (R1/R2) * (Vin - Vref), where R1 and R2 are the resistors in the feedback network, Vin is the input voltage, and Vref is the internal reference voltage (1.25V).
  • The maximum output current that the MCP1525T-I/TT can deliver is 500mA. Exceeding this current may cause the device to overheat or shut down. It is recommended to add current limiting or foldback protection to prevent damage from excessive output current.

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MCP1525T-I/TT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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