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MCP1602-ADJI/MF - Microchip

Description: Sw. Reg. PWM/PFM 2MHz 500mA Adj. DFN8

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MCP1602-ADJI/MF - Microchip - PCB symbol
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PCB Footprints
MCP1602-ADJI/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN]
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3D Models
MCP1602-ADJI/MF - Microchip - 3D model - Small Outline No-lead - 8-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN]
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MCP1602-ADJI/MF Details

  • Manufacturer Part Number:

    MCP1602-ADJI/MF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    DFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    IT CAN ALSO OPERATE WITH PULSE FREQUENCY MODULATION

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    4.5 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2400 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP1602-ADJI/MF Frequently Asked Questions (FAQs)

  • Microchip recommends a compact layout with short traces, and placing the device close to the power supply and analog input signals. Additionally, separating analog and digital grounds, and using a solid ground plane can help minimize noise and ensure optimal performance.
  • The MCP1602-ADJI/MF requires a single 2.7V to 5.5V power supply. Power sequencing is not critical, but it is recommended to power the device after the analog input signals are stable. A 0.1uF decoupling capacitor should be placed close to the device's power pin.
  • The maximum input voltage that can be applied to the analog input pins is the supply voltage (VDD) + 0.3V. Exceeding this voltage can cause damage to the device.
  • The MCP1602-ADJI/MF can be configured for unipolar or bipolar input signals by setting the corresponding bits in the configuration register. For unipolar signals, set the UNIPOLAR bit to 1, and for bipolar signals, set it to 0.
  • The maximum conversion rate of the MCP1602-ADJI/MF is 100 ksps. The conversion rate affects the power consumption, with higher conversion rates resulting in higher power consumption. The device's power consumption can be reduced by lowering the conversion rate or using the power-down mode.

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MCP1602-ADJI/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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