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MCP16311T-E/MS - Microchip

Description: Switching Controllers 30V Input, 1A, PWM/PFM Synchronous Buck Switching Regulator

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MCP16311T-E/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - MSOP
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MCP16311T-E/MS - Microchip  - 3D model - Small Outline Packages - MSOP
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MCP16311T-E/MS Details

  • Manufacturer Part Number:

    MCP16311T-E/MS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 2 TO 24V; ALSO REQUIRE PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    4.4 V

  • Input Voltage-Nom:

    7 V

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    24 V

  • Output Voltage-Min:

    2 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    575 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

MCP16311T-E/MS Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP16311T-E/MS involves keeping the input and output traces separate, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a low-ESR capacitor for the output capacitor and to keep the feedback trace as short as possible.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the output capacitor should be selected based on the output voltage and current requirements. It's also important to ensure that the input voltage is within the recommended range and that the device is operated within its specified temperature range.
  • The maximum output current of the MCP16311T-E/MS is 1.5A. However, the actual output current capability may be limited by the input voltage, output voltage, and the thermal performance of the device.
  • The MCP16311T-E/MS is rated for operation up to 125°C. However, the device's performance and reliability may be affected at high temperatures. It's essential to follow the recommended operating conditions and to ensure proper thermal management in high-temperature applications.
  • To troubleshoot issues with the MCP16311T-E/MS, start by verifying the input voltage, output voltage, and output current. Check for any signs of overheating, and ensure that the device is operated within its specified temperature range. Also, verify that the PCB layout and component selection meet the recommended guidelines.

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MCP16311T-E/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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