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MCP16502TAA-E/S8B - Microchip

Description: Power Management Specialized - PMIC High-Performance PMIC for SAMA5DX/SAM9X6 MPUs

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MCP16502TAA-E/S8B - Microchip - PCB symbol
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PCB Footprints
MCP16502TAA-E/S8B - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MCP16502TAA-E/S8B
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MCP16502TAA-E/S8B - Microchip - 3D model - Quad Flat No-Lead - MCP16502TAA-E/S8B
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MCP16502TAA-E/S8B Details

  • Manufacturer Part Number:

    MCP16502TAA-E/S8B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2019-11-25

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

MCP16502TAA-E/S8B Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP16502TAA-E/S8B involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The MCP16502TAA-E/S8B requires a single 3.3V or 5V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the device after the input voltage has reached its nominal value, and to power down the device before the input voltage drops below its minimum specified value.
  • The maximum output current capability of the MCP16502TAA-E/S8B is 2A. The device's thermal performance is affected by the output current, and it's recommended to keep the junction temperature below 125°C to ensure reliable operation. A thermal pad is available on the package to help dissipate heat.
  • The MCP16502TAA-E/S8B has a built-in overcurrent protection (OCP) feature that limits the output current to 2.5A. To implement short-circuit protection, an external current sense resistor can be used to monitor the output current, and a comparator or a microcontroller can be used to detect overcurrent conditions and shut down the device if necessary.
  • To minimize electromagnetic interference (EMI), it's recommended to use a shielded enclosure, keep the input and output traces separate, and use a common-mode choke or a ferrite bead on the output lines. Additionally, the device's switching frequency can be adjusted to minimize EMI, and a spread-spectrum clock can be used to reduce electromagnetic emissions.

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MCP16502TAA-E/S8B Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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