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MCP16502TAC-E/S8B - Microchip

Description: Power Management Specialized - PMIC High-Performance PMIC for SAMA5DX/SAM9X6 MPUs

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MCP16502TAC-E/S8B - Microchip - PCB symbol
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PCB Footprints
MCP16502TAC-E/S8B - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 2-Lead Very Thin Plastic Quad Flat, No Lead Package (S8B) - 5x5 mm Body [VQFN]
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3D Models
MCP16502TAC-E/S8B - Microchip - 3D model - Quad Flat No-Lead - 2-Lead Very Thin Plastic Quad Flat, No Lead Package (S8B) - 5x5 mm Body [VQFN]
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MCP16502TAC-E/S8B Details

  • Manufacturer Part Number:

    MCP16502TAC-E/S8B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    32

  • Manufacturer Package Code:

    VQFN-32

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2019-11-25

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

MCP16502TAC-E/S8B Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP16502TAC-E/S8B involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The MCP16502TAC-E/S8B requires a single 3.3V or 5V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the device after the input voltage has stabilized, and to ensure that the input voltage is within the recommended operating range.
  • The maximum input voltage that the MCP16502TAC-E/S8B can handle is 6V. Exceeding this voltage can cause permanent damage to the device, including latch-up or even destruction of the internal components.
  • To troubleshoot issues with the MCP16502TAC-E/S8B, start by verifying the input voltage and ensuring it's within the recommended operating range. Check the PCB layout for any noise or signal integrity issues. Use an oscilloscope to measure the output voltage and verify it's within the expected range. If issues persist, consult the datasheet and application notes for guidance.
  • The MCP16502TAC-E/S8B has a maximum junction temperature of 150°C. To ensure reliable operation in high-temperature environments, ensure good airflow around the device, use a heat sink if necessary, and avoid overheating the device. Consult the datasheet for thermal resistance and power dissipation guidelines.

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MCP16502TAC-E/S8B Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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