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MCP1650R-E/MS - Microchip

Description: Boost Controller UVLO 2V,MCP1650R-E/MS

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MCP1650R-E/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - MSOP
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MCP1650R-E/MS - Microchip  - 3D model - Small Outline Packages - MSOP
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MCP1650R-E/MS Details

  • Manufacturer Part Number:

    MCP1650R-E/MS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, MO-187, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    100 V

  • Output Voltage-Min:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    850 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP1650R-E/MS Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP1650R-E/MS involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper configuration, carefully review the datasheet and application notes, and consult with Microchip's technical support team if necessary. Also, use the Microchip's configuration tool, such as the MCP1650 Configurator, to generate the correct configuration code for your specific application.
  • The MCP1650R-E/MS has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking airflow around the device. Also, follow the thermal design guidelines in the datasheet and application notes to ensure the device operates within a safe temperature range.
  • To troubleshoot issues with the MCP1650R-E/MS, start by reviewing the datasheet and application notes, and checking the device's configuration and PCB layout. Use oscilloscopes and logic analyzers to debug the device's signals, and consult with Microchip's technical support team if necessary.
  • To ensure EMI and EMC compliance, follow the guidelines in the datasheet and application notes, and consult with Microchip's technical support team. Use shielding, filtering, and grounding techniques to minimize EMI, and ensure the device is properly configured and laid out on the PCB.

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MCP1650R-E/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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