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MCP2140-I/P - Microchip

Description: Microchip MCP2140-I/P Data Acquisition Circuit, 18-Pin PDIP

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PCB Footprints
MCP2140-I/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 18 pdip
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3D Models
MCP2140-I/P - Microchip  - 3D model - Dual-In-Line Packages - 18 pdip
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MCP2140-I/P Details

  • Manufacturer Part Number:

    MCP2140-I/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, PLASTIC, MS-001, DIP-18

  • Pin Count:

    18

  • Manufacturer Package Code:

    PDIP-18

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • JESD-30 Code:

    R-PDIP-T18

  • JESD-609 Code:

    e3

  • Length:

    22.8 mm

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP18,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    4.32 mm

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

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MCP2140-I/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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