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MCP33151-05-E/MS - Microchip

Description: Analog to Digital Converters - ADC 14-bit, 500 ksps, single channel, single-ended SAR ADC

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MCP33151-05-E/MS - Microchip - PCB symbol
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MCP33151-05-E/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 10-LEAD PLASTIC MICRO SMALL OUTLINE PACKAGE(UN)[MSOP]
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MCP33151-05-E/MS - Microchip - 3D model - Small Outline Packages - 10-LEAD PLASTIC MICRO SMALL OUTLINE PACKAGE(UN)[MSOP]
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MCP33151-05-E/MS Details

  • Manufacturer Part Number:

    MCP33151-05-E/MS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2019-06-27

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Analog Input Voltage-Max:

    5.1 V

  • Analog Input Voltage-Min:

    -0.1 V

  • Conversion Time-Max:

    0.75 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0091%

  • Number of Analog In Channels:

    1

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Sample Rate:

    0.5 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MCP33151-05-E/MS Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the MCP33151-05-E/MS evaluation board user's guide, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure accurate measurements.
  • The MCP33151-05-E/MS has an internal calibration mechanism, but it may require additional external calibration for specific applications. Microchip provides a calibration procedure in the datasheet, which involves applying known input voltages and measuring the output codes to determine the gain and offset errors.
  • The maximum sampling rate of the MCP33151-05-E/MS is 1 Msps, but the actual sampling rate may be limited by the system clock frequency and the conversion time. Higher sampling rates can increase the noise performance, but may also increase the power consumption and reduce the accuracy.
  • The MCP33151-05-E/MS has built-in overvoltage and undervoltage protection, which can detect and respond to input voltages outside the specified range. The device will enter a high-impedance state and output a error code in such cases, and can be configured to generate an interrupt or reset signal.
  • The MCP33151-05-E/MS is specified to operate from -40°C to +125°C, but the accuracy and linearity may degrade at higher temperatures. Microchip provides thermal characterization data in the datasheet, which can be used to estimate the performance at elevated temperatures.

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MCP33151-05-E/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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