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MCP3562RT-E/ST - Microchip

Description: 24-BIT DELTA-SIGMA ADC W/VREF, D

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MCP3562RT-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 20-Lead Plastic Thin Shrink Small Outline (ST) - 4.4mm body [TSSOP]
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3D Models
MCP3562RT-E/ST - Microchip  - 3D model - Small Outline Packages - 20-Lead Plastic Thin Shrink Small Outline (ST) - 4.4mm body [TSSOP]
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MCP3562RT-E/ST Details

  • Manufacturer Part Number:

    MCP3562RT-E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    20

  • Manufacturer Package Code:

    TSSOP-20

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Analog Input Voltage-Max:

    3.6 V

  • Analog Input Voltage-Min:

    -2.7 V

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Linearity Error-Max (EL):

    0.0032%

  • Number of Analog In Channels:

    4

  • Number of Bits:

    24

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2'S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Sample Rate:

    0.1536 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

MCP3562RT-E/ST Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane, and to keep analog and digital signals separate. Use short, direct traces for the analog inputs and avoid crossing digital signals over the analog inputs. Also, use a common mode filter capacitor (e.g., 10nF) between the analog input pins and the AGND pin.
  • Calibration involves adjusting the internal gain and offset registers to compensate for device variations. Use the built-in calibration registers and follow the calibration procedure outlined in the datasheet. You can also use the MCP3562's built-in self-test feature to verify the calibration.
  • Power up the device in the following sequence: VDD, AVDD, and then the clock signal. Ensure that the power supplies are stable and within the recommended voltage range before applying the clock signal. Also, ensure that the analog input pins are not driven until the device is fully powered up.
  • Use external voltage limiting resistors and diodes to protect the analog inputs from overvoltage conditions. For undervoltage conditions, use a voltage reference (e.g., MCP1501) to provide a stable voltage source for the analog inputs. Also, consider using input protection devices (e.g., TVS diodes) for additional protection.
  • Use a clock signal with a frequency between 1-50 MHz, and ensure that the clock signal is stable and has a low jitter. You can use an external crystal oscillator or a clock generator IC (e.g., MCP1541) to provide a stable clock signal. Also, ensure that the clock signal is properly terminated and routed to minimize noise and reflections.

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MCP3562RT-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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