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MCP3909-I/SS - Microchip

Description: Energy Meter IC,SPI,MCP3909-I/SS

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MCP3909-I/SS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (SS)24-Lead(SSOP)
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MCP3909-I/SS - Microchip  - 3D model - Small Outline Packages - (SS)24-Lead(SSOP)
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MCP3909-I/SS Details

  • Manufacturer Part Number:

    MCP3909-I/SS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    0.209 INCH, LEAD FREE, PLASTIC, SSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    SSOP-24

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP24,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2 mm

  • Supply Current-Max (Isup):

    2.8 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

MCP3909-I/SS Frequently Asked Questions (FAQs)

  • Microchip provides a recommended layout and routing guide in the MCP3909 datasheet, which includes guidelines for PCB layout, component placement, and routing to minimize noise and ensure optimal performance.
  • The MCP3909-I/SS requires calibration to ensure accurate measurements. Calibration involves adjusting the gain and offset of the ADC using the CAL pin. Refer to the datasheet for a detailed calibration procedure.
  • The maximum sampling rate of the MCP3909-I/SS is 100 kSPS (kilosamples per second). However, the actual sampling rate may vary depending on the system clock frequency and the configuration of the device.
  • Yes, the MCP3909-I/SS can operate with a 3.3V power supply. However, the device's performance may be affected, and the maximum sampling rate may be reduced. Refer to the datasheet for specific guidelines on operating the device with a 3.3V power supply.
  • The MCP3909-I/SS can be interfaced with a microcontroller using the SPI (Serial Peripheral Interface) protocol. The device provides a dedicated SPI interface for data transfer and configuration.

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MCP3909-I/SS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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