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MCP4706A2T-E/CH - Microchip

Description: Microchip MCP4706A2T-E/CH, Serial DAC, 6-Pin SOT-23

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Symbol
MCP4706A2T-E/CH - Microchip - PCB symbol
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PCB Footprints
MCP4706A2T-E/CH - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - (CH) [SOT-23]
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3D Models
MCP4706A2T-E/CH - Microchip - 3D model - SOT23 (6-Pin) - (CH) [SOT-23]
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MCP4706A2T-E/CH Details

  • Manufacturer Part Number:

    MCP4706A2T-E/CH

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT-23-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Analog Output Voltage-Max:

    5.46 V

  • Analog Output Voltage-Min:

    0.01 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Linearity Error-Max (EL):

    0.3543%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.45 mm

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Current-Max:

    0.4 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Width:

    1.55 mm

MCP4706A2T-E/CH Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP4706A2T-E/CH involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog layer to minimize noise and crosstalk.
  • To ensure the accuracy of the DAC output voltage, it's essential to use a high-precision voltage reference, such as the MCP1541, and to follow proper PCB layout and routing guidelines. Additionally, calibrating the DAC output voltage using an external calibration circuit can help improve accuracy.
  • The maximum clock frequency that can be used with the MCP4706A2T-E/CH is 1 MHz. However, it's recommended to use a clock frequency of 500 kHz or less to ensure reliable operation and minimize power consumption.
  • Yes, the MCP4706A2T-E/CH can be used in a multi-channel application. The device has a built-in channel sequencer that allows it to control multiple channels. However, it's essential to ensure that the device is properly configured and that the channel sequencing is correctly implemented to avoid any potential issues.
  • To troubleshoot issues with the MCP4706A2T-E/CH, it's essential to follow a systematic approach. Start by verifying the power supply voltage and ensuring that the device is properly configured. Then, use a logic analyzer or oscilloscope to verify the serial communication signals and DAC output voltage. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines.

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MCP4706A2T-E/CH Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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