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MCP47FEB21A1-E/ST - Microchip

Description: Digital to Analog Converters - DAC Single channel 12bit nonvolatile, I2C DAC 12 Bit 1 8-TSSOP

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MCP47FEB21A1-E/ST - Microchip - PCB symbol
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PCB Footprints
MCP47FEB21A1-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP]
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MCP47FEB21A1-E/ST Details

  • Manufacturer Part Number:

    MCP47FEB21A1-E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TSSOP-8

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Analog Output Voltage-Max:

    5.46 V

  • Analog Output Voltage-Min:

    0.01 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Linearity Error-Max (EL):

    0.1464%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP47FEB21A1-E/ST Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the device's datasheet and application notes. It's essential to follow these guidelines to ensure optimal performance, especially for high-frequency signals. Key considerations include keeping analog and digital signals separate, using a solid ground plane, and minimizing trace lengths and impedance mismatches.
  • To ensure accurate voltage reference performance, it's crucial to follow proper layout and design practices. This includes using a low-impedance power supply, decoupling the VREF pin with a capacitor, and minimizing noise coupling from digital signals. Additionally, consider using a voltage reference bypass capacitor to filter out high-frequency noise.
  • The MCP47FEB21A1-E/ST has an operating temperature range of -40°C to +125°C. However, it's essential to note that the device's performance may degrade at extreme temperatures. Be sure to consult the datasheet for specific temperature-related specifications and derating information.
  • The MCP47FEB21A1-E/ST's non-volatile memory can be programmed using Microchip's MPLAB X IDE software and a compatible programmer/debugger, such as the MPLAB PICkit 4. Consult the device's datasheet and programming guide for specific instructions and requirements.
  • To ensure EMI and EMC compliance, it's essential to follow proper PCB layout and design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, consider using a spread-spectrum clock generator to reduce EMI emissions.

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MCP47FEB21A1-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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