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MCP47FVB21A0-E/ST - Microchip

Description: Digital to Analog Converters - DAC Single channel 12bit volatile, I2C DAC

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MCP47FVB21A0-E/ST - Microchip - PCB symbol
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PCB Footprints
MCP47FVB21A0-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP]
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3D Models
MCP47FVB21A0-E/ST - Microchip - 3D model - Small Outline Packages - 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm Body [TSSOP]
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MCP47FVB21A0-E/ST Details

  • Manufacturer Part Number:

    MCP47FVB21A0-E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TSSOP-8

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Analog Output Voltage-Max:

    5.46 V

  • Analog Output Voltage-Min:

    0.01 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Linearity Error-Max (EL):

    0.1465%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage-Nom:

    5.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP47FVB21A0-E/ST Frequently Asked Questions (FAQs)

  • Microchip provides a layout and routing guide in their application note AN1349, which recommends using a 4-layer PCB with a dedicated analog ground plane, and following specific routing guidelines for the analog and digital signals.
  • The MCP47FVB21A0-E/ST has an internal calibration mechanism, but it may require additional external calibration for high-accuracy applications. Microchip provides a calibration procedure in their application note AN1348, which involves using a precision voltage reference and a calibration routine.
  • The maximum output current of the MCP47FVB21A0-E/ST is 20mA. Exceeding this current limit can affect the output voltage accuracy, so it's essential to ensure that the output current is within the specified limit. Microchip provides guidance on output current and voltage accuracy in their datasheet and application notes.
  • The MCP47FVB21A0-E/ST has a SPI-compatible interface, which can be easily interfaced with most microcontrollers. Microchip provides example code and interface guidelines in their datasheet and application notes, as well as a software development kit (SDK) for popular microcontrollers.
  • The MCP47FVB21A0-E/ST has a maximum junction temperature of 150°C. To ensure reliable operation over temperature, it's essential to follow proper thermal design and layout guidelines, such as using a heat sink or thermal pad, and ensuring good airflow around the device. Microchip provides thermal design guidelines in their datasheet and application notes.

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MCP47FVB21A0-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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