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MCP6002T-E/MC - Microchip

Description: OpAmp 2ch 1.8V 1MHz bias1pA lowPower RtR out30mA

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PCB Footprints
MCP6002T-E/MC - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - (MC)8-Lead(DFN)
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3D Models
MCP6002T-E/MC - Microchip  - 3D model - Small Outline No-lead - (MC)8-Lead(DFN)
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MCP6002T-E/MC Details

  • Manufacturer Part Number:

    MCP6002T-E/MC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    DFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    0.34 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    25110

  • Wideband:

    NO

  • Width:

    2 mm

MCP6002T-E/MC Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6002T-E/MC is 670 mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability, it's recommended to use a gain resistor (Rg) between 1 kΩ and 10 kΩ, and a feedback capacitor (Cf) between 10 pF and 100 pF, depending on the specific application requirements.
  • To minimize noise and EMI, it's recommended to use a star-ground configuration, keep the input and output traces short and away from each other, and use a ground plane to shield the device.
  • Yes, the MCP6002T-E/MC can be used in a single-supply configuration, but it's recommended to use a voltage divider to set the input common-mode voltage to half of the supply voltage.
  • The MCP6002T-E/MC has built-in ESD protection, but it's still recommended to use external ESD protection devices, such as TVS diodes or ESD arrays, to protect the device from electrostatic discharge.

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MCP6002T-E/MC Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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