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MCP601-I/ST - Microchip

Description: IC, Op Amp, single, 2.7V, I temp, MCP601-I/ST

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MCP601-I/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead ST TSSOP
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MCP601-I/ST - Microchip  - 3D model - Small Outline Packages - 8 Lead ST TSSOP
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MCP601-I/ST Details

  • Manufacturer Part Number:

    MCP601-I/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    TSSOP-8

  • Country Of Origin:

    Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    2.3 V/us

  • Supply Current-Max:

    0.325 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    2800

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    3 mm

MCP601-I/ST Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP601-I/ST is 670 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability in a unity-gain buffer configuration, add a capacitor (typically 10-100 pF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • To minimize noise and EMI, use a star-ground configuration, keep the input and output traces short and symmetrical, and avoid running digital signals near the op-amp's analog signals. Also, use a ground plane and decouple the power supply with capacitors.
  • Yes, the MCP601-I/ST can be used as a comparator, but it's not recommended due to its relatively slow slew rate (0.5 V/μs) and limited bandwidth (1 MHz). For comparator applications, consider using a dedicated comparator IC with faster response times and higher bandwidth.
  • The input impedance of the MCP601-I/ST is typically around 10^12 Ω (1 TΩ) in common-mode and 10^9 Ω (1 GΩ) in differential mode. This high input impedance makes the op-amp suitable for high-impedance sources, but may require additional circuitry to ensure stability and prevent oscillations.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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