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MCP6023-I/SN - Microchip

Description: Sngl 2.5V 10MHz OpAmp w/CS,MCP6023-I/SN

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PCB Footprints
MCP6023-I/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead(SN) SOIC
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MCP6023-I/SN - Microchip  - 3D model - Small Outline Packages - 8-Lead(SN) SOIC
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MCP6023-I/SN Details

  • Manufacturer Part Number:

    MCP6023-I/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00015 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    7 V/us

  • Supply Current-Max:

    1.35 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    3.91 mm

MCP6023-I/SN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6023 is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 720mW at 25°C. For the MSOP package, it is 560mW at 25°C. It is essential to ensure that the device does not exceed these limits to prevent overheating and damage.
  • To minimize noise and ensure optimal performance, it is recommended to follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and keeping sensitive analog signals away from noisy digital signals. Additionally, it is essential to place decoupling capacitors close to the power pins of the MCP6023 and to use a low-ESR capacitor for the bypass capacitor.
  • The recommended operating voltage range for the MCP6023 is 2.7V to 6.0V. Operating the device outside of this range may affect its performance and reliability.
  • The choice of gain resistors depends on the desired gain and bandwidth of the amplifier. A higher gain resistor value will result in a higher gain but may also reduce the bandwidth. It is essential to consult the datasheet and perform calculations to determine the optimal gain resistor values for your specific application.
  • The input impedance of the MCP6023 is typically around 10^12 ohms in parallel with 2pF. This high input impedance makes the device suitable for use in high-impedance sensor applications.

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MCP6023-I/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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