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MCP6041-E/SN - Microchip

Description: OP Amp Single GP R-R I/O 6V

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MCP6041-E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 23A640-I/SN
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MCP6041-E/SN - Microchip  - 3D model - Small Outline Packages - 23A640-I/SN
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MCP6041-E/SN Details

  • Manufacturer Part Number:

    MCP6041-E/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    62 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.003 V/us

  • Supply Current-Max:

    0.001 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    14

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6041-E/SN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6041-E/SN is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 720mW at 25°C ambient temperature. For the MSOP package, it is 450mW at 25°C ambient temperature.
  • To ensure stability in a unity-gain configuration, it is recommended to add a capacitor (typically 10nF to 100nF) between the output and the inverting input pins. This capacitor helps to compensate for the internal pole of the op-amp and prevents oscillations.
  • To minimize noise and EMI, it is recommended to follow good PCB layout and routing practices, such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the op-amp pins. Additionally, it is recommended to use a low-impedance power supply and to avoid running high-frequency signals near the op-amp.
  • The MCP6041-E/SN is rated for operation up to 125°C, but its performance may degrade at high temperatures. It is recommended to derate the op-amp's power dissipation and to ensure that the device is properly heat-sinked to prevent overheating.
  • The input bias current of the MCP6041-E/SN can be calculated using the formula: IB = (VCC - VEE) / (2 * RIN), where IB is the input bias current, VCC is the positive supply voltage, VEE is the negative supply voltage, and RIN is the input resistance. The input bias current is typically in the range of 1-10pA.

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MCP6041-E/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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