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MCP607-I/P - Microchip

Description: Microchip MCP607-I/P, Dual Op Amp, 155kHz Rail-Rail, 8-Pin PDIP

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MCP607-I/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PDIP
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MCP607-I/P Details

  • Manufacturer Part Number:

    MCP607-I/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    PDIP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00008 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    250 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.27 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    5.33 mm

  • Slew Rate-Nom:

    0.08 V/us

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    155

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    7.62 mm

MCP607-I/P Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP607-I/P is 670 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability, ensure that the feedback loop has a phase margin of at least 45° and a gain margin of at least 10 dB. You can use the datasheet's open-loop gain and phase plots to determine the stability of your specific application.
  • To minimize noise and ensure optimal performance, use a star-ground topology, keep the input and output traces short and symmetrical, and avoid running digital signals near the op-amp's analog signals. Also, use a 0.1 μF decoupling capacitor between the power pins and ground.
  • While the MCP607-I/P can be used as a comparator, it's not the most suitable op-amp for this application due to its relatively slow slew rate (0.5 V/μs) and limited output current (±20 mA). Consider using a dedicated comparator IC for high-speed or high-current comparator applications.
  • The MCP607-I/P has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent damage. Use an anti-static wrist strap or mat, and ensure that your PCB design includes ESD protection components, such as TVS diodes or ESD arrays, as needed.

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MCP607-I/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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