MCP607TI/ST - Microchip

MCP607TI/ST Details

• Manufacturer Part Number:

  MCP607TI/ST

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  SOIC

• Package Description:

  TSSOP,

• Pin Count:

  8

• Reach Compliance Code:

  Compliant

• Manufacturer:

  Microchip Technology Inc

• Amplifier Type:

  OPERATIONAL AMPLIFIER

• Average Bias Current-Max (IIB):

  0.00008 µA

• Common-mode Reject Ratio-Nom:

  91 dB

• Input Offset Voltage-Max:

  250 µV

• JESD-30 Code:

  R-PDSO-G8

• JESD-609 Code:

  e3

• Length:

  4.4 mm

• Moisture Sensitivity Level:

  1

• Number of Functions:

  2

• Number of Terminals:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.2 mm

• Slew Rate-Nom:

  0.08 V/us

• Subcategory:

  Operational Amplifier

• Supply Voltage Limit-Max:

  7 V

• Supply Voltage-Nom (Vsup):

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  MATTE TIN

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Unity Gain BW-Nom:

  155

• Width:

  3 mm