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MCP6274-E/P - Microchip

Description: Microchip MCP6274-E/P, Quad Op Amp, 2MHz Rail-Rail, 14-Pin PDIP

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MCP6274-E/P - Microchip - PCB symbol
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PCB Footprints
MCP6274-E/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 14-Lead PDIP (P) - 300 mil Body [PDIP]
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3D Models
MCP6274-E/P - Microchip - 3D model - Dual-In-Line Packages - 14-Lead PDIP (P) - 300 mil Body [PDIP]
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MCP6274-E/P Details

  • Manufacturer Part Number:

    MCP6274-E/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    14

  • Manufacturer Package Code:

    PDIP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDIP-T14

  • JESD-609 Code:

    e3

  • Length:

    19.05 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.334 mm

  • Slew Rate-Nom:

    0.9 V/us

  • Supply Current-Max:

    0.96 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    7.62 mm

MCP6274-E/P Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6274-E/P is dependent on the package type and ambient temperature. For the PDIP package, it is 670 mW at 25°C, and for the QFN package, it is 450 mW at 25°C. Refer to the thermal resistance and power dissipation sections in the datasheet for more information.
  • To ensure stability in a unity-gain configuration, it is recommended to add a capacitor (typically 10-100 pF) between the output and the inverting input pins. This helps to compensate for the internal pole and ensures stability. Additionally, make sure to follow proper PCB layout and decoupling practices.
  • The recommended input common-mode voltage range for the MCP6274-E/P is between VDD - 1.2V and VSS + 1.2V. Operating outside of this range may affect the op-amp's performance and stability.
  • While the MCP6274-E/P can be used as a comparator, it is not recommended due to its op-amp architecture. The device is optimized for linear operation, and its performance as a comparator may not be as good as a dedicated comparator device. If you need a comparator, consider using a dedicated comparator device like the MCP6541 or MCP65R41.
  • The output voltage swing of the MCP6274-E/P is dependent on the supply voltage and the load resistance. A good rule of thumb is to assume the output voltage swing is approximately 1.5V less than the supply voltage. For example, with a 5V supply, the output voltage swing would be around 3.5V. However, this can vary depending on the specific application and load conditions.

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MCP6274-E/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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