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MCP6282-E/P - Microchip

Description: Microchip MCP6282-E/P, Dual Op Amp, 5MHz CMOS, Rail to Rail, 3 V, 5 V, 8-Pin PDIP

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MCP6282-E/P - Microchip PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Lead Plastic Dual In-line (P)
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MCP6282-E/P - Microchip  - 3D model - Dual-In-Line Packages - 8-Lead Plastic Dual In-line (P)
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MCP6282-E/P Details

  • Manufacturer Part Number:

    MCP6282-E/P

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    0.300 INCH, PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    PDIP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.271 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.334 mm

  • Slew Rate-Nom:

    2.5 V/us

  • Supply Current-Max:

    1.14 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    5000

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    7.62 mm

MCP6282-E/P Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6282-E/P is dependent on the package type and ambient temperature. For the PDIP package, it is 670 mW at 25°C, while for the QFN package, it is 450 mW at 25°C. Refer to the datasheet for more information on power dissipation calculations.
  • To ensure stability in a unity-gain configuration, it is recommended to add a capacitor (typically 10-22 pF) between the output and the negative input pins. This helps to compensate for the internal pole and ensures stability.
  • To minimize noise and EMI, it is recommended to follow good PCB layout practices, such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the power pins. Additionally, avoid routing high-frequency signals near the op-amp inputs.
  • While the MCP6282-E/P can be used as a comparator, it is not recommended due to its relatively slow slew rate (0.5 V/μs) and limited output current drive capability. Microchip offers dedicated comparator products, such as the MCP6541, which are better suited for comparator applications.
  • The MCP6282-E/P has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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MCP6282-E/P Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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