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MCP6294T-E/ST - Microchip

Description: • Gain Bandwidth Product: 10 MHz (typical) • Supply Current: IQ = 1.0 mA • Supply Voltage: 2.4V to 6.0V • Rail-to-Rail Input/Output • Extended Temperature Range: -40°C to +125°C • Available in Single, Dual and Quad Packages • Single with CS (MCP6293) • Dual with CS (MCP6295)

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MCP6294T-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - .14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
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3D Models
MCP6294T-E/ST - Microchip  - 3D model - Small Outline Packages - .14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
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MCP6294T-E/ST Details

  • Manufacturer Part Number:

    MCP6294T-E/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    4.40 MM, PLASTIC, MO-153, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Malaysia, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    7 V/us

  • Supply Current-Max:

    5.2 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    31620

  • Wideband:

    NO

  • Width:

    4.4 mm

MCP6294T-E/ST Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6294T-E/ST is 670 mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability in a unity-gain buffer configuration, it's recommended to add a capacitor (typically 10-100 pF) between the output and the inverting input to prevent oscillations.
  • To minimize noise and EMI, it's recommended to keep the input and output traces short and away from each other, use a ground plane, and decouple the power supply with a 10-100 nF capacitor.
  • While the MCP6294T-E/ST can be used as a comparator, it's not recommended due to its relatively slow slew rate and limited bandwidth. A dedicated comparator IC would be a better choice for most applications.
  • The MCP6294T-E/ST has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing, such as using an ESD wrist strap or mat.

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MCP6294T-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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