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MCP6484-E/ST - Microchip

Description: Microchip MCP6484-E/ST Low Power Op Amp, 4MHz Rail-Rail, 2.2 → 5.5 V, 14-Pin TSSOP

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MCP6484-E/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - **14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
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3D Models
MCP6484-E/ST - Microchip  - 3D model - Small Outline Packages - **14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
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MCP6484-E/ST Details

  • Manufacturer Part Number:

    MCP6484-E/ST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4.40 MM, PLASTIC, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00035 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    89 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    2.7 V/us

  • Supply Current-Max:

    1.6 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    4000

  • Voltage Gain-Min:

    56200

  • Wideband:

    NO

  • Width:

    4.4 mm

MCP6484-E/ST Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6484-E/ST is 670 mW, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability in a unity-gain buffer configuration, it's recommended to add a capacitor (typically 10-100 pF) between the output and the inverting input to compensate for the op-amp's internal capacitance.
  • To minimize noise and EMI, it's recommended to keep the input and output traces short and away from each other, use a ground plane, and decouple the power supply with capacitors (e.g., 10 uF and 100 nF) as close to the op-amp as possible.
  • The MCP6484-E/ST is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. Ensure proper heat sinking and thermal management to prevent overheating.
  • The input bias current of the MCP6484-E/ST is typically 1.5 nA. To minimize its effect, use high-impedance sources, add a voltage follower stage, or use a current-limiting resistor in series with the input signal.

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MCP6484-E/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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