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MCP6549-I/SL - Microchip

Description: Quad 1.6V Open Drain Comp,MCP6549-I/SL

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MCP6549-I/SL - Microchip - PCB symbol
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MCP6549-I/SL - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead(SL) SOIC
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MCP6549-I/SL - Microchip - 3D model - Small Outline Packages - 14-Lead(SL) SOIC
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MCP6549-I/SL Details

  • Manufacturer Part Number:

    MCP6549-I/SL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, PLASTIC, SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOIC-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    3000 ns

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.004 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.9 mm

MCP6549-I/SL Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding layout, keeping the analog and digital grounds separate, and placing the device close to the power supply. Additionally, it's essential to minimize the length of the input traces and keep them away from noisy digital signals.
  • Consult the datasheet for the recommended biasing and configuration for your specific application. Additionally, Microchip provides application notes and design guides that can help with proper biasing and configuration. It's also recommended to consult with a Microchip FAE or a experienced engineer for specific guidance.
  • The MCP6549-I/SL has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a thermal pad or heat sink, and keep the device away from heat sources. Also, follow the recommended PCB layout and thermal design guidelines to minimize thermal resistance.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check the power supply, input signals, and output loads for any anomalies. Use an oscilloscope to visualize the signals and identify any issues. If the problem persists, consult with a Microchip FAE or a experienced engineer for further assistance.
  • Yes, the MCP6549-I/SL is susceptible to EMI/EMC. Follow the recommended PCB layout and design guidelines to minimize EMI/EMC issues. Use shielding, filtering, and grounding techniques to reduce emissions and improve immunity. Consult with a Microchip FAE or a experienced engineer to ensure compliance with regulatory standards such as CISPR and FCC.

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MCP6549-I/SL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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