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MCP659-E/ML - Microchip

Description: MCP659-E/ML Microchip, Op Amp, 50MHz, 2.5 → 5.5 V, 16-Pin QFN

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Symbol
MCP659-E/ML - Microchip - PCB symbol
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PCB Footprints
MCP659-E/ML - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MCP659-E/ML*
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3D Models
MCP659-E/ML - Microchip - 3D model - Quad Flat No-Lead - MCP659-E/ML*
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MCP659-E/ML Details

  • Manufacturer Part Number:

    MCP659-E/ML

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    68 dB

  • Common-mode Reject Ratio-Nom:

    84 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    200 µV

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    30 V/us

  • Supply Current-Max:

    36 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    50000

  • Voltage Gain-Min:

    25118

  • Wideband:

    NO

  • Width:

    4 mm

MCP659-E/ML Frequently Asked Questions (FAQs)

  • Microchip recommends following a star-grounding scheme, using a solid ground plane, and keeping analog and digital signals separate to minimize noise. Additionally, use short and direct traces for the power and ground connections.
  • To optimize performance in high-temperature environments, ensure good thermal dissipation by using a heat sink or a thermally conductive material, and consider using a thermal interface material to improve heat transfer. Also, reduce the power consumption by optimizing the clock frequency and using power-saving modes.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF) close to the power pins to filter out noise. Ensure a stable power supply by using a voltage regulator with a low dropout voltage and a high power supply rejection ratio (PSRR). Also, use a ferrite bead or a common-mode choke to filter out high-frequency noise.
  • Use a logic analyzer or an oscilloscope to capture and analyze the signals. Check the power supply voltage, clock frequency, and signal integrity. Verify that the device is properly configured and that the firmware is correct. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • Follow good EMC design practices, such as using a metal enclosure, shielding, and filtering. Ensure that the PCB layout is optimized for EMC, and use EMI filters or common-mode chokes to reduce emissions. Consult the datasheet and application notes for specific EMC guidelines.

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MCP659-E/ML Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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