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MCP65R41T-1202E/CHY - Microchip

Description: MICROCHIP - MCP65R41T-1202E/CHY - Analogue Comparator, Single, Low Power, 1 Comparator, 4 µs, 1.8V to 5.5V, SOT-23, 6 Pins

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Symbol
MCP65R41T-1202E/CHY - Microchip - PCB symbol
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PCB Footprints
MCP65R41T-1202E/CHY - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - (CHY)(SOT-23)
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3D Models
MCP65R41T-1202E/CHY - Microchip - 3D model - SOT23 (6-Pin) - (CHY)(SOT-23)
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MCP65R41T-1202E/CHY Details

  • Manufacturer Part Number:

    MCP65R41T-1202E/CHY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT-23-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    4000 ns

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    0.004 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.55 mm

MCP65R41T-1202E/CHY Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note from Microchip provides additional recommendations.
  • To ensure reliable communication over the SPI interface, make sure to follow the SPI protocol guidelines, use a clock frequency within the recommended range, and ensure proper signal termination and routing on the PCB. Additionally, consider using a SPI bus analyzer to debug any issues.
  • To ensure EMI and EMC compliance, follow proper PCB layout and routing guidelines, use shielding and grounding techniques, and consider using EMI filters or common-mode chokes. Additionally, perform EMI and EMC testing to ensure compliance with relevant standards.
  • Follow the recommended power-up and power-down sequencing guidelines in the datasheet, and ensure that the device is powered up and down slowly to prevent damage. Consider using a power management IC to simplify the power sequencing process.
  • To ensure proper thermal management and heat dissipation, follow the recommended thermal design guidelines, use a heat sink or thermal pad, and ensure good airflow around the device. Consider using thermal simulation tools to optimize the thermal design.

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MCP65R41T-1202E/CHY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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