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MCP662T-E/MS - Microchip

Description: Operational Amplifiers - Op Amps Dual 60MHz OP E Temp

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MCP662T-E/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - MSOP-1
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MCP662T-E/MS Details

  • Manufacturer Part Number:

    MCP662T-E/MS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    81 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    32 V/us

  • Supply Current-Max:

    18 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    60000

  • Voltage Gain-Min:

    25100

  • Wideband:

    NO

  • Width:

    3 mm

MCP662T-E/MS Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP662T-E/MS involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The choice of external components for the MCP662T-E/MS depends on the specific application and operating conditions. In general, X7R or X5R ceramic capacitors are recommended for the input and output capacitors, with values ranging from 1uF to 10uF. The datasheet provides guidelines for selecting the optimal component values.
  • The maximum power dissipation of the MCP662T-E/MS is 1.4W. To ensure it doesn't overheat, it's essential to provide adequate heat sinking, such as a thermal pad or a heat sink, and to keep the device within the recommended operating temperature range of -40°C to 125°C.
  • The MCP662T-E/MS can be configured for a specific output voltage by adjusting the resistive divider network connected to the FB pin. The device's adjustable output voltage range is from 0.8V to 5.5V, with a minimum output voltage of 0.8V and a maximum output voltage of 5.5V.
  • The MCP662T-E/MS and the MCP16301 are both high-performance, low-dropout regulators, but they have different features and specifications. The MCP662T-E/MS has a wider input voltage range (2.7V to 6.5V) and a higher maximum output current (500mA) compared to the MCP16301. The MCP16301, on the other hand, has a lower quiescent current and a smaller package option.

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MCP662T-E/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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