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MCP665-E/UN - Microchip

Description: Dual, 60MHz OP w /CS, E temp

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Symbol
MCP665-E/UN - Microchip - PCB symbol
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PCB Footprints
MCP665-E/UN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - UN(MSOP)
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3D Models
MCP665-E/UN - Microchip - 3D model - Small Outline Packages - UN(MSOP)
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MCP665-E/UN Details

  • Manufacturer Part Number:

    MCP665-E/UN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    PLASTIC, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    81 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    32 V/us

  • Supply Current-Max:

    18 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    60000

  • Voltage Gain-Min:

    25100

  • Wideband:

    NO

  • Width:

    3 mm

MCP665-E/UN Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the MCP665-E/UN evaluation board user's guide, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • Microchip provides application notes and design guides that provide configuration guidelines for specific applications, including battery-powered devices and high-temperature environments. Additionally, the MCP665-E/UN datasheet provides a detailed description of the device's configuration options and registers.
  • The MCP665-E/UN has a maximum junction temperature of 150°C, and thermal management is critical to ensure reliable operation. Microchip recommends using thermal vias, thermal pads, and heat sinks to dissipate heat, and provides thermal management guidelines in the datasheet and application notes.
  • Microchip provides a troubleshooting guide in the datasheet and application notes, which includes common issues and their solutions. Additionally, engineers can use debugging tools such as oscilloscopes and logic analyzers to identify and troubleshoot issues.
  • The MCP665-E/UN is designed to meet EMI and EMC regulatory requirements, and Microchip provides guidelines for EMI and EMC compliance in the datasheet and application notes. Engineers should also follow good design practices, such as using shielding, filtering, and grounding to minimize EMI and EMC issues.

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MCP665-E/UN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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