MCP669-E/ML - Microchip

MCP669-E/ML Details

• Manufacturer Part Number:

  MCP669-E/ML

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  QFN

• Package Description:

  4 X 4 MM, 0.90 MM, ROHS COMPLIANT, PLASTIC, QFN-16

• Pin Count:

  16

• Manufacturer Package Code:

  VQFN-16

• Country Of Origin:

  Thailand

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  6 Weeks

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  14

• Amplifier Type:

  OPERATIONAL AMPLIFIER

• Architecture:

  VOLTAGE-FEEDBACK

• Average Bias Current-Max (IIB):

  0.005 µA

• Common-mode Reject Ratio-Min:

  66 dB

• Common-mode Reject Ratio-Nom:

  81 dB

• Frequency Compensation:

  YES

• Input Offset Voltage-Max:

  8000 µV

• JESD-30 Code:

  S-PQCC-N16

• JESD-609 Code:

  e3

• Length:

  4 mm

• Low-Bias:

  YES

• Low-Offset:

  NO

• Micropower:

  NO

• Moisture Sensitivity Level:

  1

• Number of Functions:

  4

• Number of Terminals:

  16

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVQCCN

• Package Equivalence Code:

  LCC16,.16SQ,25

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Packing Method:

  TUBE

• Peak Reflow Temperature (Cel):

  260

• Power:

  NO

• Programmable Power:

  NO

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1 mm

• Slew Rate-Nom:

  32 V/us

• Supply Current-Max:

  36 mA

• Supply Voltage Limit-Max:

  6.5 V

• Supply Voltage-Nom (Vsup):

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Unity Gain BW-Nom:

  60000

• Voltage Gain-Min:

  25100

• Wideband:

  NO

• Width:

  4 mm