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MCP6G04-E/SL - Microchip

Description: MCP6G04-E/SL, Programmable Gain Amplifier 4, Rail to Rail Input/Output, 14-Pin SOIC N

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MCP6G04-E/SL - Microchip - PCB symbol
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PCB Footprints
MCP6G04-E/SL - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - (SL)14-Lead(SOIC)2003ver
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3D Models
MCP6G04-E/SL - Microchip - 3D model - Small Outline Packages - (SL)14-Lead(SOIC)2003ver
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MCP6G04-E/SL Details

  • Manufacturer Part Number:

    MCP6G04-E/SL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    0.150 INCH, PLASTIC, MS-012, SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOIC-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bandwidth (3dB)-Nom:

    0.9 MHz

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.69 mm

  • Moisture Sensitivity Level:

    1

  • Non-linearity-Max:

    0.05%

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    4.5 V/us

  • Supply Current-Max:

    0.68 mA

  • Supply Voltage Limit-Max:

    7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Gain-Max:

    50

  • Voltage Gain-Min:

    1

  • Voltage Gain-Nom:

    10

  • Width:

    3.9 mm

MCP6G04-E/SL Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6G04-E/SL is dependent on the package type and ambient temperature. For the SOIC package, the maximum power dissipation is 720mW at 25°C ambient temperature. For the MSOP package, it is 450mW at 25°C ambient temperature.
  • To ensure stability in high-gain configurations, it is recommended to use a compensation capacitor between the output and the inverting input pins. The value of the capacitor depends on the gain and bandwidth requirements of the application. A good starting point is to use a capacitor value of 10-22pF.
  • To minimize noise and EMI, it is recommended to follow good PCB layout and routing practices, such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the power pins. Additionally, it is recommended to use a low-impedance power supply and to avoid running high-frequency signals near the op-amp inputs.
  • Yes, the MCP6G04-E/SL can be used in a single-supply configuration. However, the input common-mode voltage range is limited to VDD - 1.5V to VDD + 0.5V, so the input signal must be biased accordingly. Additionally, the output voltage swing will be limited to VDD - 1.5V to VDD + 0.5V.
  • To protect the MCP6G04-E/SL from overvoltage and ESD damage, it is recommended to use input protection diodes and resistors, as well as a TVS (Transient Voltage Suppressor) diode on the power supply lines. Additionally, it is recommended to follow proper handling and storage procedures to prevent ESD damage.

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MCP6G04-E/SL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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