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MCP6L4T-E/SL - Microchip

Description: Quad 2.7V Op Amp, Extended temp

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MCP6L4T-E/SL - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead(SL) SOIC
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MCP6L4T-E/SL - Microchip  - 3D model - Small Outline Packages - 14-Lead(SL) SOIC
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MCP6L4T-E/SL Details

  • Manufacturer Part Number:

    MCP6L4T-E/SL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, LEAD FREE, PLASTIC, SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOIC-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    2.3 V/us

  • Supply Current-Max:

    1.32 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    2800

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6L4T-E/SL Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP6L4T-E/SL involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the stability of the output voltage, it's essential to use a suitable output capacitor with a low equivalent series resistance (ESR) and a high capacitance value. A minimum output capacitance of 10uF is recommended, and the capacitor should be placed close to the device.
  • The maximum input voltage that the MCP6L4T-E/SL can handle is 42V. Exceeding this voltage may damage the device. It's essential to ensure that the input voltage is within the recommended range to ensure reliable operation.
  • The power dissipation of the MCP6L4T-E/SL can be calculated using the formula: Pd = (Vin - Vout) x Iout. Where Vin is the input voltage, Vout is the output voltage, and Iout is the output current. It's essential to ensure that the power dissipation is within the recommended range to prevent overheating.
  • The recommended input capacitor value for the MCP6L4T-E/SL is 1uF to 10uF, with a voltage rating of at least 50V. A higher capacitance value can help to reduce input ripple and improve overall performance.

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MCP6L4T-E/SL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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