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MCP6L71T-E/OT - Microchip

Description: Single 2 MHz OP Amp, Extended temp

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PCB Footprints
MCP6L71T-E/OT - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5LD SOT-23
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3D Models
MCP6L71T-E/OT - Microchip  - 3D model - SOT23 (5-Pin) - 5LD SOT-23
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MCP6L71T-E/OT Details

  • Manufacturer Part Number:

    MCP6L71T-E/OT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.9 V/us

  • Supply Current-Max:

    0.24 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    2000

  • Wideband:

    NO

  • Width:

    1.55 mm

MCP6L71T-E/OT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6L71T-E/OT is 670 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W) specified in the datasheet.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, consider using a phase margin analyzer tool to verify stability.
  • For optimal performance, keep the input and output traces short and symmetrical, avoid crossing signal traces, and use a solid ground plane. Also, place decoupling capacitors close to the op-amp's power pins and use a low-ESR capacitor for the bypass capacitor.
  • While the MCP6L71T-E/OT is rated for operation up to 125°C, it's essential to consider the device's thermal characteristics and ensure proper heat sinking and cooling in high-temperature environments. Consult the datasheet and application notes for guidance.
  • To minimize EMI, use a shielded enclosure, keep the op-amp and surrounding components away from high-frequency sources, and use EMI filters or shielding on the input and output lines. Additionally, consider using a common-mode choke or ferrite beads to reduce EMI.

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MCP6L71T-E/OT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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