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MCP6L74T-E/SL - Microchip

Description: Operational Amplifiers - Op Amps Quad 2 MHz OP E temp

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MCP6L74T-E/SL - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead(SL) SOIC
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MCP6L74T-E/SL - Microchip  - 3D model - Small Outline Packages - 14-Lead(SL) SOIC
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MCP6L74T-E/SL Details

  • Manufacturer Part Number:

    MCP6L74T-E/SL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    0.50 INCH, ROHS COMPLIANT, PLASTIC, SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    SOIC-14

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Nom:

    91 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.9 V/us

  • Supply Current-Max:

    0.96 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    2000

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6L74T-E/SL Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6L74T-E/SL is dependent on the package type and thermal resistance. For the 14-pin TSSOP package, the maximum power dissipation is approximately 670 mW at 25°C ambient temperature.
  • To ensure stability in high-gain configurations, it's essential to follow proper PCB layout practices, such as minimizing parasitic capacitance and inductance, using a solid ground plane, and placing bypass capacitors close to the op-amp. Additionally, consider adding a small capacitor (e.g., 10-100 pF) in parallel with the feedback resistor to improve stability.
  • The recommended input impedance for the MCP6L74T-E/SL is greater than 1 kΩ to ensure optimal performance and minimize input bias current effects. However, the input impedance can be lower if the source impedance is matched to the op-amp's input impedance.
  • While the MCP6L74T-E/SL can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (0.5 V/μs) and limited output current drive capability. Microchip offers dedicated comparator products, such as the MCP654, which are more suitable for comparator applications.
  • The MCP6L74T-E/SL has built-in ESD protection, but it's still essential to follow proper ESD handling practices during manufacturing and assembly. Additionally, consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to protect the op-amp and other sensitive components.

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MCP6L74T-E/SL Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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