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MCP6N11-005E/SN - Microchip

Description: Microchip MCP6N11-005E/SN Instrumentation Amplifier, 0.35V Offset 2.5MHz GBW, CMMR 80dB, 1.8 → 5.5 V, 8-Pin SOIC

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MCP6N11-005E/SN - Microchip - PCB symbol
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MCP6N11-005E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-LEAD SMALL OUTLINE (SN)
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MCP6N11-005E/SN - Microchip - 3D model - Small Outline Packages - 8-LEAD SMALL OUTLINE (SN)
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MCP6N11-005E/SN Details

  • Manufacturer Part Number:

    MCP6N11-005E/SN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    3.90 MM, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bandwidth (3dB)-Nom:

    35 MHz

  • Common-mode Reject Ratio-Min:

    62 dB

  • Input Offset Current-Max (IIO):

    0.001 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Non-linearity-Max:

    0.05%

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    9 V/us

  • Supply Current-Max:

    1.1 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Voltage Gain-Min:

    15848

  • Voltage Gain-Nom:

    251188

  • Width:

    3.9 mm

MCP6N11-005E/SN Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6N11-005E/SN is 670 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W).
  • To ensure stability, it's recommended to use a gain resistor (Rg) between the output and the inverting input, and a capacitor (Cc) in parallel with Rg to compensate for the op-amp's input capacitance. The values of Rg and Cc depend on the specific application and gain configuration.
  • To minimize noise and oscillations, it's recommended to keep the input and output traces short and away from each other, use a ground plane, and decouple the power supply with capacitors. Additionally, avoid routing high-frequency signals near the op-amp's inputs and outputs.
  • While the MCP6N11-005E/SN can be used as a comparator, it's not the most suitable op-amp for this application due to its relatively slow slew rate (2.5 V/μs) and limited bandwidth (5.5 MHz). A dedicated comparator IC would be a better choice for most applications.
  • To protect the MCP6N11-005E/SN from ESD, it's recommended to handle the device by the body, use an anti-static wrist strap or mat, and store the device in an anti-static bag or container. Additionally, ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays.

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MCP6N11-005E/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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