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MCP6N11T-001E/MNY - Microchip

Description: Microchip MCP6N11T-001E/MNY Instrumentation Amplifier, 3mV Offset, CMMR 70dB, 5.5 V, 8-Pin TDFN, R-RI/O

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MCP6N11T-001E/MNY - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - (MN) [TDFN]
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3D Models
MCP6N11T-001E/MNY - Microchip  - 3D model - Small Outline No-lead - (MN) [TDFN]
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MCP6N11T-001E/MNY Details

  • Manufacturer Part Number:

    MCP6N11T-001E/MNY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 2 MM, 0.75 MM HEIGHT, TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bandwidth (3dB)-Nom:

    35 MHz

  • Common-mode Reject Ratio-Min:

    62 dB

  • Input Offset Current-Max (IIO):

    0.001 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Non-linearity-Max:

    0.05%

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    9 V/us

  • Supply Current-Max:

    1.1 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Gain-Min:

    3162

  • Voltage Gain-Nom:

    50118

  • Width:

    2 mm

MCP6N11T-001E/MNY Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the MCP6N11T-001E/MNY is 670 mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W).
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, consider using a phase margin analyzer tool to simulate and optimize the feedback loop.
  • The recommended input impedance for the MCP6N11T-001E/MNY is between 1 kΩ and 100 kΩ. This range ensures optimal performance, noise reduction, and minimal input bias current effects.
  • While the MCP6N11T-001E/MNY can be used as a comparator, it's not the most suitable choice. The device is optimized for linear amplifier applications, and its performance as a comparator may not be ideal. Consider using a dedicated comparator IC for such applications.
  • To ensure ESD protection, follow proper handling and storage procedures, use ESD-protective packaging, and consider adding external ESD protection devices (e.g., TVS diodes) to the PCB design.

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MCP6N11T-001E/MNY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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