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MCP6S22-I/MS - Microchip

Description: Special Purpose Amplifiers 2-Chan. 12 MHz SPI

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MCP6S22-I/MS - Microchip - PCB symbol
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PCB Footprints
MCP6S22-I/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
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3D Models
MCP6S22-I/MS - Microchip - 3D model - Small Outline Packages - 8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
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MCP6S22-I/MS Details

  • Manufacturer Part Number:

    MCP6S22-I/MS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.18 mm

  • Supply Current-Max (Isup):

    1.35 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    4 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP6S22-I/MS Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP6S22-I/MS involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce noise and improve performance.
  • To ensure accuracy at high temperatures, it's essential to consider the device's temperature coefficient, which is specified in the datasheet. Additionally, using a thermocouple or thermistor to measure the temperature and compensating for temperature effects can help maintain accuracy. It's also important to follow proper PCB design and layout practices to minimize thermal gradients.
  • The recommended input impedance for the MCP6S22-I/MS is 1 kΩ or higher. A higher input impedance can help reduce noise and improve the device's common-mode rejection ratio (CMRR). However, if the input impedance is too high, it can lead to increased noise and reduced accuracy. A good starting point is to use a 1 kΩ to 10 kΩ input impedance and adjust as needed based on the specific application.
  • To filter out noise and interference, use a low-pass filter or a band-pass filter at the input stage to remove high-frequency noise. Additionally, using a shielded cable or a twisted pair cable can help reduce electromagnetic interference (EMI). It's also important to follow proper PCB design and layout practices to minimize noise coupling and radiation.
  • The maximum input voltage that the MCP6S22-I/MS can handle is ±16.5V. Exceeding this voltage can cause permanent damage to the device, including latch-up or even destruction. It's essential to ensure that the input voltage remains within the specified range to maintain the device's accuracy and reliability.

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MCP6S22-I/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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