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MCP6S26-I/ST - Microchip

Description: Microchip MCP6S26-I/ST, Programmable Gain Amplifier 6, Rail to Rail Input/Output, 14-Pin TSSOP

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MCP6S26-I/ST - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 14-Lead Plastic Thin Shrink Small Outline (ST)
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3D Models
MCP6S26-I/ST - Microchip  - 3D model - Small Outline Packages - 14-Lead Plastic Thin Shrink Small Outline (ST)
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MCP6S26-I/ST Details

  • Manufacturer Part Number:

    MCP6S26-I/ST

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    4.40 MM, PLASTIC, TSSOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    TSSOP-14

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    6

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    1.35 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    4 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4.4 mm

MCP6S26-I/ST Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP6S26-I/ST involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane can help to reduce noise and improve performance.
  • To ensure the accuracy of the internal voltage reference, it is recommended to use a high-quality external capacitor (e.g. 10uF) connected between the VREF pin and GND. This helps to filter out noise and ensure a stable reference voltage.
  • The maximum input voltage that the MCP6S26-I/ST can handle without damage is 6V. Exceeding this voltage can cause permanent damage to the device.
  • The gain of the PGA can be configured by writing to the Gain Control Register (GCR) using the SPI interface. The gain can be set to 1, 2, 4, 8, 16, 32, or 64.
  • The maximum sampling rate of the MCP6S26-I/ST's ADC is 500 ksps (kilosamples per second).

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MCP6S26-I/ST Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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