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MCP6S92-E/SN - Microchip

Description: 2-Chan 10MHz SPI PGA,MCP6S92-E/SN

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MCP6S92-E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead(SN) SOIC (150 mil)
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3D Models
MCP6S92-E/SN - Microchip  - 3D model - Small Outline Packages - 8-Lead(SN) SOIC (150 mil)
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MCP6S92-E/SN Details

  • Manufacturer Part Number:

    MCP6S92-E/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    0.150 MM INCH, PLASTIC, MS-012, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    1.6 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.91 mm

MCP6S92-E/SN Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the MCP6S92-E/SN evaluation board user's guide, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The MCP6S92-E/SN has a programmable gain amplifier (PGA) that can be configured using the SPI interface. The gain and bandwidth can be set using the PGA gain and bandwidth registers, respectively. Refer to the datasheet for the specific register settings and equations to calculate the desired gain and bandwidth.
  • The maximum input voltage that the MCP6S92-E/SN can handle is ±VDD + 0.3V, where VDD is the supply voltage. However, it's recommended to limit the input voltage to ±VDD to ensure optimal performance and prevent damage to the device.
  • The MCP6S92-E/SN is specified to operate from -40°C to +125°C. Ensure that the device is properly heatsinked and that the PCB is designed to dissipate heat effectively. Also, consider using thermal management techniques such as thermal vias and thermal pads to keep the device within its specified temperature range.
  • The recommended power-up sequence for the MCP6S92-E/SN is to apply the supply voltage (VDD) first, followed by the reference voltage (VREF), and then the input signal. This ensures that the device powers up correctly and minimizes the risk of latch-up or damage.

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MCP6S92-E/SN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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