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MCP6S93-E/UN - Microchip

Description: Microchip MCP6S93-E/UN, Programmable Gain Amplifier 2, Rail to Rail Input/Output, 10-Pin MSOP

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MCP6S93-E/UN - Microchip - PCB symbol
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PCB Footprints
MCP6S93-E/UN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 10-Lead Plastic Micro Small Outline Package (MS) [MSOP]
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3D Models
MCP6S93-E/UN - Microchip - 3D model - Small Outline Packages - 10-Lead Plastic Micro Small Outline Package (MS) [MSOP]
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MCP6S93-E/UN Details

  • Manufacturer Part Number:

    MCP6S93-E/UN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    PLASTIC, MO-187, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    1.6 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

MCP6S93-E/UN Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP6S93-E/UN involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane can help to reduce noise and improve performance.
  • The gain resistor values for the MCP6S93-E/UN depend on the specific application requirements. A good starting point is to use the recommended values in the datasheet, and then adjust them based on the desired gain and bandwidth. It's also important to consider the noise floor and distortion requirements of the application when selecting the gain resistors.
  • The maximum input voltage that the MCP6S93-E/UN can handle is ±5.5V, which is the absolute maximum rating. However, the recommended input voltage range is ±3.5V to ensure optimal performance and to prevent damage to the device.
  • The MCP6S93-E/UN has a built-in low-pass filter that can be used to filter out high-frequency noise. Additionally, external filters such as RC filters or active filters can be used to further reduce noise. It's also important to consider the noise floor and distortion requirements of the application when designing the filter.
  • The typical settling time of the MCP6S93-E/UN is around 2.5μs, but this can vary depending on the specific application and the output load. It's important to consider the settling time requirements of the application when designing the circuit.

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MCP6S93-E/UN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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