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MCP6V28-E/SN - Microchip

Description: Microchip MCP6V28-E/SN Precision Op Amp, 2MHz Rail-Rail, 2.3 → 5.5 V, 8-Pin SOIC

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MCP6V28-E/SN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Plastic Small Outline (SN)- Narrow, 3.90 mm Body [SOIC]
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MCP6V28-E/SN - Microchip  - 3D model - Small Outline Packages - 8-Lead Plastic Small Outline (SN)- Narrow, 3.90 mm Body [SOIC]
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MCP6V28-E/SN Details

  • Manufacturer Part Number:

    MCP6V28-E/SN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3.90 MM, PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Common-mode Reject Ratio-Min:

    125 dB

  • Common-mode Reject Ratio-Nom:

    142 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    1778000

  • Wideband:

    NO

  • Width:

    3.9 mm

MCP6V28-E/SN Frequently Asked Questions (FAQs)

  • Microchip recommends a star-ground configuration, with the GND pin connected to a solid ground plane, and the VIN and VOUT pins connected to separate power planes. Additionally, keep the input and output capacitors close to the device and use short, wide traces to minimize inductance.
  • To ensure stability, use a minimum output capacitance of 10uF, and ensure that the output capacitor has a low equivalent series resistance (ESR). Additionally, the output voltage should be decoupled from the input voltage using a 1uF to 10uF capacitor.
  • The maximum input voltage for the MCP6V28-E/SN is 36V, but it's recommended to operate within the specified input voltage range of 4.5V to 28V for optimal performance and reliability.
  • The MCP6V28-E/SN is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. It's recommended to derate the output current and input voltage according to the temperature derating curve in the datasheet.
  • The power dissipation of the MCP6V28-E/SN can be calculated using the formula: Pd = (VIN - VOUT) x IOUT + VIN x IQ, where IQ is the quiescent current. Ensure that the device is operated within the specified power dissipation rating to prevent overheating.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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