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MCP6V67-E/MS - Microchip

Description: MICROCHIP - MCP6V67-E/MS - Operational Amplifier, 2 Amplifier, 1 MHz, 0.45 V/µs, 1.8V to 5.5V, MSOP, 8 Pins

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MCP6V67-E/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - MSOP
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MCP6V67-E/MS - Microchip  - 3D model - Small Outline Packages - MSOP
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MCP6V67-E/MS Details

  • Manufacturer Part Number:

    MCP6V67-E/MS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    11 Weeks

  • Date Of Intro:

    2019-10-21

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    111 dB

  • Common-mode Reject Ratio-Nom:

    134 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.45 V/us

  • Supply Current-Max:

    0.26 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    316227

  • Wideband:

    NO

  • Width:

    3 mm

MCP6V67-E/MS Frequently Asked Questions (FAQs)

  • Microchip recommends a star-ground configuration, with the GND pin connected to a solid ground plane, and the VIN and VOUT pins connected to separate power planes. Additionally, keep the input and output capacitors close to the device and use short, wide traces to minimize inductance and resistance.
  • To ensure stability, use a minimum output capacitance of 10uF, and consider adding a 10nF-100nF ceramic capacitor in parallel to improve transient response. Also, ensure the input voltage is within the recommended range (2.2V to 6V) and the load current is within the specified range (up to 500mA).
  • The maximum allowed input voltage ripple is 100mV peak-to-peak. Exceeding this limit may affect the device's performance and stability.
  • The MCP6V67-E/MS is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Consider derating the output current and using thermal management techniques to ensure reliable operation.
  • The MCP6V67-E/MS has built-in overcurrent protection (OCP) and short-circuit protection (SCP). However, consider adding external protection components, such as fuses or PTC resistors, to provide additional protection against fault conditions.

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MCP6V67-E/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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