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MCP6V71UT-E/LTY - Microchip

Description: Precision Amplifiers Zero Drift Op Amp Single, E-Temp

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PCB Footprints
MCP6V71UT-E/LTY - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Lead Plastic Small Outline Transistor (LTY) [SC70]
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3D Models
MCP6V71UT-E/LTY - Microchip  - 3D model - SOT23 (5-Pin) - 5-Lead Plastic Small Outline Transistor (LTY) [SC70]
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MCP6V71UT-E/LTY Details

  • Manufacturer Part Number:

    MCP6V71UT-E/LTY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    5

  • Manufacturer Package Code:

    SC70-5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    117 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TAPE AND REEL

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.26 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    707950

  • Wideband:

    NO

  • Width:

    1.25 mm

MCP6V71UT-E/LTY Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP6V71UT-E/LTY involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 10uF, and to place the output capacitor close to the device. Additionally, the input voltage should be well-regulated and free of noise.
  • The maximum ambient temperature range for the MCP6V71UT-E/LTY is -40°C to +125°C. However, the device can operate up to 150°C with a reduced lifetime.
  • Yes, the MCP6V71UT-E/LTY is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high reliability. However, it is recommended to follow the recommended operating conditions and to perform thorough testing and validation.
  • To troubleshoot issues with the MCP6V71UT-E/LTY, start by checking the input voltage, output voltage, and output current. Verify that the device is properly soldered and that the PCB layout is correct. Use an oscilloscope to check for noise and oscillations. Consult the datasheet and application notes for troubleshooting guides and FAQs.

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MCP6V71UT-E/LTY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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