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MCP6V96UT-E/LTY - Microchip

Description: Operational Amplifiers - Op Amps Single, Zero-Drift Op Amp, E Temp

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MCP6V96UT-E/LTY - Microchip - PCB symbol
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PCB Footprints
MCP6V96UT-E/LTY - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - (LT) [SC70]--
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3D Models
MCP6V96UT-E/LTY - Microchip - 3D model - SOT23 (5-Pin) - (LT) [SC70]--
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MCP6V96UT-E/LTY Details

  • Manufacturer Part Number:

    MCP6V96UT-E/LTY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    5

  • Manufacturer Package Code:

    SC70-5

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    112 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    9.5 V/us

  • Supply Current-Max:

    1.6 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    10

  • Voltage Gain-Min:

    70794.578

  • Wideband:

    NO

  • Width:

    1.25 mm

MCP6V96UT-E/LTY Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP6V96UT-E/LTY involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for the input bypass capacitor.
  • To ensure the stability of the output voltage, it's essential to use a suitable output capacitor with a low equivalent series resistance (ESR). The output capacitor should be placed as close as possible to the device, and the output voltage should be decoupled with a capacitor to prevent oscillations.
  • The maximum power dissipation of the MCP6V96UT-E/LTY is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the ambient temperature and the thermal resistance of the package.
  • The MCP6V96UT-E/LTY is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and derate the power dissipation accordingly to ensure reliable operation.
  • To protect the MCP6V96UT-E/LTY from input voltage transients, it's recommended to use a transient voltage suppressor (TVS) diode or a voltage clamp circuit at the input. Additionally, a fuse or a current-limiting resistor can be used to prevent overcurrent conditions.

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MCP6V96UT-E/LTY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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