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MCP6V97T-E/MNY - Microchip

Description: Dual, Zero-Drift Op Amp, E Temp

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MCP6V97T-E/MNY - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - ----8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
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MCP6V97T-E/MNY - Microchip  - 3D model - Small Outline No-lead - ----8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
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MCP6V97T-E/MNY Details

  • Manufacturer Part Number:

    MCP6V97T-E/MNY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    TDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    112 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    9.5 V/us

  • Supply Current-Max:

    3.2 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    10

  • Voltage Gain-Min:

    70794.578

  • Wideband:

    NO

  • Width:

    2 mm

MCP6V97T-E/MNY Frequently Asked Questions (FAQs)

  • Microchip recommends a star-ground configuration, with the device's GND pin connected to a central ground point, and all other grounds connected to this point. Additionally, keep the input and output traces separate and away from each other to minimize noise coupling.
  • The device requires a stable voltage supply (VDD) between 2.7V and 5.5V, and a bias voltage (VREF) between 1.2V and 3.6V. Ensure that the voltage supply is decoupled with a 10uF capacitor, and the bias voltage is decoupled with a 1uF capacitor.
  • The maximum input voltage that the MCP6V97T-E/MNY can handle without damage is 7V. Exceeding this voltage may cause permanent damage to the device.
  • The output voltage (VOUT) of the MCP6V97T-E/MNY is determined by the input voltage (VIN), the gain resistor (RG), and the feedback resistor (RF). Use the formula: VOUT = VIN x (1 + (RF/RG)) to calculate the output voltage.
  • The typical settling time of the MCP6V97T-E/MNY is around 10us to 20us, depending on the input signal frequency and amplitude. This is the time it takes for the output voltage to stabilize after a change in the input signal.

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MCP6V97T-E/MNY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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