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MCP73113-16SI/MF - Microchip

Description: Single cell 6.5 OVP battery Charger

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MCP73113-16SI/MF - Microchip - PCB symbol
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PCB Footprints
MCP73113-16SI/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - MCP73113-06SI/MF
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3D Models
MCP73113-16SI/MF - Microchip - 3D model - Small Outline No-lead - MCP73113-06SI/MF
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MCP73113-16SI/MF Details

  • Manufacturer Part Number:

    MCP73113-16SI/MF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    DFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    16 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    5.1 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.1V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP73113-16SI/MF Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP73113-16SI/MF involves keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The MCP73113-16SI/MF requires a single 3.3V or 5V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the device after the input voltage has reached its nominal value, and to power down the device before the input voltage drops below its minimum specified value.
  • The MCP73113-16SI/MF has a thermal junction-to-ambient thermal resistance of 45°C/W. To ensure it doesn't overheat, it's recommended to provide adequate airflow, use a heat sink if necessary, and keep the device away from other heat sources. The maximum junction temperature is 150°C.
  • To troubleshoot issues with the MCP73113-16SI/MF, start by checking the power supply, input voltage, and output voltage. Verify that the device is properly configured and that the input and output capacitors are correctly sized. Common pitfalls to avoid include incorrect power sequencing, inadequate decoupling, and poor PCB layout.
  • The MCP73113-16SI/MF is designed to meet the electromagnetic compatibility (EMC) requirements of various regulatory bodies. To ensure compliance, follow proper PCB layout and design practices, use shielding and filtering as necessary, and perform EMC testing to ensure the device meets the required standards.

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MCP73113-16SI/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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