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MCP73114-1NSI/MF - Microchip

Description: Battery Management SNGL C, 5.8V OVP BC 4.1V regulation

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PCB Footprints
MCP73114-1NSI/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - MCP73114-1NSI/MF
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3D Models
MCP73114-1NSI/MF - Microchip  - 3D model - Small Outline No-lead - MCP73114-1NSI/MF
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MCP73114-1NSI/MF Details

  • Manufacturer Part Number:

    MCP73114-1NSI/MF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    10

  • Manufacturer Package Code:

    DFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    6.5 V

  • Supply Voltage-Min (Vsup):

    4.2 V

  • Supply Voltage-Nom (Vsup):

    5.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.2V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP73114-1NSI/MF Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper area on the other side of the PCB.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It is also recommended to derate the output current and voltage according to the temperature derating curves provided in the datasheet.
  • The recommended input capacitor is a 10uF ceramic capacitor with a voltage rating of at least 10V. The recommended output capacitor is a 22uF ceramic capacitor with a voltage rating of at least 5V. However, the actual capacitor values may vary depending on the specific application and operating conditions.
  • To troubleshoot issues with the device not turning on or not regulating properly, check the input voltage, output voltage, and enable pin voltage using an oscilloscope or multimeter. Ensure that the input voltage is within the recommended range, the output voltage is within the expected range, and the enable pin is properly biased. Also, check for any short circuits or open circuits on the PCB.
  • The recommended EMI filtering for this device includes a common-mode choke and a differential-mode filter capacitor at the input. Additionally, a ferrite bead or a common-mode choke can be used at the output to reduce electromagnetic interference (EMI). The actual EMI filtering components may vary depending on the specific application and operating conditions.

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MCP73114-1NSI/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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