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MCP73123-22SI/MF - Microchip

Description: 6.5V Single cell LiFePO4 battery charger

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MCP73123-22SI/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - (MF)10-Lead(DFN)
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MCP73123-22SI/MF - Microchip  - 3D model - Small Outline No-lead - (MF)10-Lead(DFN)
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MCP73123-22SI/MF Details

  • Manufacturer Part Number:

    MCP73123-22SI/MF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    DFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    6.5 V

  • Supply Voltage-Min (Vsup):

    4.2 V

  • Supply Voltage-Nom (Vsup):

    4.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP73123-22SI/MF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, and to consider the device's thermal derating. Additionally, ensure that the device is operated within its specified temperature range, and that the PCB is designed to minimize thermal resistance.
  • For EMI and EMC compliance, it's essential to follow proper PCB layout and design guidelines, such as keeping sensitive analog circuits away from noisy digital circuits, using shielding and filtering, and ensuring good grounding and decoupling. Additionally, consider using EMI filters and shielding on the device's inputs and outputs.
  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage and current, and checking for any signs of overheating. Then, check the output voltage and current, and verify that the device is operating within its specified parameters. If issues persist, check the PCB layout and design for any potential issues, such as noise or oscillation.
  • Operating the device at the maximum rated current can lead to increased power dissipation, which can result in higher temperatures and reduced reliability. It's essential to ensure that the device is properly cooled, and that the PCB is designed to handle the increased power dissipation. Additionally, consider derating the device's current rating to ensure reliable operation.

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MCP73123-22SI/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image MCP73123T-22SI/MF Microchip Technology Inc

Adjustable, 1 Channel, +3.6V, PDSO10