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MCP73123T-22SI/MF - Microchip

Description: Battery Charge Controller Li-Ion 130mA to 1100mA 3.6V 10-Pin DFN EP T/R

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MCP73123T-22SI/MF - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - MCP73123T-22SI/MF
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MCP73123T-22SI/MF - Microchip  - 3D model - Small Outline No-lead - MCP73123T-22SI/MF
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MCP73123T-22SI/MF Details

  • Manufacturer Part Number:

    MCP73123T-22SI/MF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    DFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Supply Voltage-Max (Vsup):

    6.5 V

  • Supply Voltage-Min (Vsup):

    4.2 V

  • Supply Voltage-Nom (Vsup):

    4.6 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +3.6V

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP73123T-22SI/MF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider using a thermally-enhanced package or a device with a higher temperature rating.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to operate the device within the recommended voltage, current, and temperature ranges to ensure reliable operation and to prevent damage to the device.
  • To troubleshoot issues with the device's output voltage regulation, start by verifying the input voltage, output voltage, and load current. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use an oscilloscope to monitor the output voltage and check for any signs of oscillation or noise.
  • To minimize EMI and EMC issues, ensure that the device is properly decoupled, and use a low-ESR capacitor for input filtering. Implement a good PCB layout with a solid ground plane, and consider using shielding or a metal can to reduce electromagnetic radiation. Follow proper PCB design practices, such as using a star-configuration for power and ground, and minimizing loop areas.

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MCP73123T-22SI/MF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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